A practical implementation of silicon microchannel coolers for high power chips

By Evan G. Colgan, Bruce K. Furman, A. Gaynes, W. Graham, N. LaBianca, J. H. Magerlein, Robert J. Polastre, M. B. Rothwell, R. J. Bezama, Rehan Choudhary and 4 more. Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005., 2005

233 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/991c2dce4a4e8742622c4fdc542289276f56c15a

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Citations in the corpus

Numerical study of thermal enhancement in micro channel heat sink with secondary flow (2014, result): “[19] compared various offset in fin geometries from the experimental results and shown that the 75 or 100 lm pitch silicon micro channel with staggered fins achieve excellent heat transfer performance.”
Scale effects on flow boiling heat transfer in microchannels: A fundamental perspective (2010, background): “At microscale, however, this paradigm is now open to question due to recent advances in single-phase heat transferwithwater in enhancedmicrochannels that have yielded heat transfer coefficients in excess of 500,000 W/m2 C and are able to remove heat fluxes of 500W/cm2 [1,2].”
Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture (2006, background): “This range is based on the pressure available from compact and reliable pumps and the pressure losses across components such as tubes, connectors, filters, and heat exchangers in the cooling loop [1].”
High Flux Heat Removal with Microchannels—A Roadmap of Challenges and Opportunities (2005, methodology): “Colgan et al. [ 5 ] provided the results of a practical implementation of enhanced microchannels with a strip-fin geometry.”
Co-designing electronics with microfluidics for more sustainable cooling (2020, background): “…Everhart et al. 2007 Bare die MMC bare die cooling Power diode Experimental [35] Escher et al. 2010 Embedded MMC Logic Experimental [64] Colgan et al. 2005 Embedded or indirect Offset strip fin Logic Experimental [69] Ditri et al. 2015 Bare die Multi-jet Bare die cooling Numerical &…”
State of the Art of High Heat Flux Cooling Technologies (2007, background): “[6], who used a staggered channel configuration.”
Boiling heat transfer in a hydrofoil-based micro pin fin heat sink (2007, background): “Initial studies were dedicated to reveal the thermal and hydrodynamic characteristics of microchannel flows, but recently emerging reports extend this effort to other configurations like pin fins [29–35].”
History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review (2012, background): “[50] reported a practical implementation of liquid cooling using enhanced microchannels with offset-strip-fin geometry to dissipate very high heat fluxes.”
Flow boiling of water in a circular staggered micro-pin fin heat sink (2008, background): “Recently, configurations like pin fin based micro-channel heat sinks have also been explored, but primarily for single-phase flow [10–14].”