Deformation behavior of thin copper films on deformable substrates

By M. Hommel, Oliver Kraft. 2001

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Thin Film Materials: Stress, Defect Formation and Surface Evolution (2004, background): “Experimental results obtained by Huang and Spaepen (2000) and Hommel and Kraft (2001) on the tensile stress{strain response of several di®erent thin ̄lm materials were examined in Section 7.”
The effect of film thickness on the failure strain of polymer-supported metal films (2010, background): “[18] Hommel M, Kraft O.”
Cyclic deformation of polycrystalline Cu films (2003, methodology): “A detailed description of this experiment has been given by Hommel et al. (1999) and Hommel and Kraft (2001).”
Stretchability and compliance of freestanding serpentine-shaped ribbons (2014, background): “The elastic regime of metal deformation is still limited to 1% or less (Hommel and Kraft, 2001).”
Delocalizing strain in a thin metal film on a polymer substrate (2005, background): “Hommel and Kraft (2001) deformed Cu films on a polyimide substrate up to 2% strains, but did not report any rupture behavior.”
Plastic deformation of freestanding thin films: Experiments and modeling (2006, background): “(Vlassak and Nix, 1992; Shen et al., 1998; Hommel and Kraft, 2001; Espinosa et al., 2003, 2004; Dehm et al., 2003; Lou et al., 2003; Phillips et al., 2004; Florando and Nix, 2005; Xiang et al., 2005), and to modeling their size-dependent behavior, e.”