Delocalizing strain in a thin metal film on a polymer substrate

By Teng Li, Zy Huang, Z. Xi, Sp P. Lacour, Sigurd Wagner, Zhigang Suo. 2005

249 citations recorded by the source corpus.

Subfields: Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/3242bd1ee220b5a3097e11b0cfa1e308cfc6f356

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In Mechanics of Materials

1. Zhigang Suo
2. Nanshu Lu
3. Stéphanie P. Lacour
4. J. Vlassak
5. Sigurd Wagner
6. Joyelle Jones

Citations in the corpus

• The effect of film thickness on the failure strain of polymer-supported metal films (2010, methodology): “For a metal film that is well bonded to a polymer substrate, finite element simulations have shown that the polymer substrate can suppress necking in the metal film, so that the film can elongate indefinitely, limited only by rupture of the polymer substrate [14, 15].”
• Design and performance of thin metal film interconnects for skin-like electronic circuits (2004, background): “Modeling suggests that several of the deviations of the electrical resistance from first-order approximations observed in our experiments may result from mechanical phenomena that occur on a length scale comparable to the metal film thickness, i.e., on the nanometer scale [14], [15].”
• Stretchable Interconnects for Elastic Electronic Surfaces (2005, unknown): “experimental and modeling studies [22].”