Reliability Physics and Engineering: Time-To-Failure Modeling
By J. McPherson. 2010
326 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/93de5db7306ad88c094687c285c7354293b9a12d
How researchers see this paper
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In Electrical and Electronic Engineering
- Frede Blaabjerg
- Huai Wang
- Marco Liserre
- Xiongfei Wang
- Friedrich Wilhelm Fuchs
- Ke Ma
- Yun Wei Li
- Poh Chiang Loh
Citations in the corpus
- Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device (2017, background): “When the heat source is considered for the thermal analysis, the differential equation for the temperature calculation of the element in each layer is given by [32]”
- Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics (2014, background): “A typical stress-strain (σ-ε) curve for a material [55].”