Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide
By Saurav Goel, Xichun Luo, Robert L. Reuben. 2012
146 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Materials Chemistry, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/8213ecd979a02786b3861015b0158e611ececa9e
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In Biomedical Engineering
- Saurav Goel
- Xichun Luo
- Robert L. Reuben
- Gerry Byrne
- Fengzhou Fang
- Wei Gao
- Hans Nørgaard Hansen
- Yuebin B. Guo
In Materials Chemistry
In Mechanics of Materials
Citations in the corpus
- Wear mechanism of diamond tools against single crystal silicon in single point diamond turning process (2013, methodology): “The plucking of surface atoms from the diamond tool and subsequent abrasion between a thin layer of SiC and the cutting tool causes sp–sp disorder on the diamond tool [63,64].”
- Brittle-ductile transition during diamond turning of single crystal silicon carbide (2013, background): “A recent simulation based study has showed interfacial abrasion to be the dominant mechanism of tool wear during SPDT of SiC which results in graphitization of the diamond [28,42].”
- Nanomanufacturing—Perspective and applications (2017, background): “For silicon carbide, the graphitization accompanying the high-temperature softening of diamond is the main wear mechanism [75].”