Wear mechanism of diamond tools against single crystal silicon in single point diamond turning process
By Saurav Goel, Xichun Luo, Robert L. Reuben. 2013
190 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Materials Chemistry, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/28100354b0a1c4d97be08381da10582f8783764f
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In Biomedical Engineering
In Materials Chemistry
- Saurav Goel
- A. Kovalchenko
- G. Cross
- Alexander Stukowski
- Xichun Luo
- M. Yaghoobi
- George Z. Voyiadjis
- J. Weissmuller
In Mechanics of Materials
Citations in the corpus
- Influence of microstructure on the cutting behaviour of silicon (2016, background): “under similar conditions [45, 46], and it was found that such periodical grooves, which are known from cutting experiments, occur only with the screened empirical bond-order potential.”
- Diamond machining of silicon: A review of advances in molecular dynamics simulation (2015, unknown): “Thus, SiC can either be formed in the cutting chips or as a thin film on the surface of the diamond tool.”