Ductile regime turning at large tool feed

By Jiwang Yan, K. Syoji, Tsunemoto Kuriyagawa, Hirofumi Suzuki. 2002

174 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/6163b0b56a08a4e1241eddb382dbb15bf9317a22

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Saurav Goel
2. Xichun Luo
3. Robert L. Reuben
4. Jiwang Yan
5. Tsunemoto Kuriyagawa
6. Zhiyu Zhang
7. Gerry Byrne
8. Fengzhou Fang

In Materials Chemistry

1. Saurav Goel
2. Xichun Luo
3. Robert L. Reuben
4. Jiwang Yan
5. Tsunemoto Kuriyagawa
6. Zhiyu Zhang
7. A. Kovalchenko
8. G. Cross

In Mechanical Engineering

1. Jiwang Yan
2. Saurav Goel
3. Gerry Byrne
4. Yuebin B. Guo
5. G. Cross
6. Tsunemoto Kuriyagawa
7. Alexander Stukowski
8. Hans Nørgaard Hansen

Citations in the corpus

• Nanomanufacturing—Perspective and applications (2017, background): “diamond on the flank face with silicon and oxygen are accompanied with grooves and stair-type structures [230].”
• Mechanism for material removal in diamond turning of reaction-bonded silicon carbide (2009, methodology): “This result is distinctly different from that for cutting Si [11], where beyond a critical undeformed chip thickness, the”
• Some observations on the wear of diamond tools in ultra-precision cutting of single-crystal silicon (2003, methodology): “As known from the previous experimental results [6], the undeformed chip thickness of 90 nm is just below the minimum critical chip thickness (or critical depth, dc = 92 nm) for ductile–brittle transition thus it corresponds to the largest material removal rate in ductile regime; whereas the undefor”
• Brittle-ductile transition during diamond turning of single crystal silicon carbide (2013, background): “nose cutting tools and low feed rates are preferred to obtain a crack free machined surface while machining brittle materials [31].”
• Diamond machining of silicon: A review of advances in molecular dynamics simulation (2015, unknown): “Figure 14: Crystallographic direction dependence of minimum un-deformed chip thickness in silicon [37]”
• Influence of microstructure on the cutting behaviour of silicon (2016, background): “A wealth of literature suggests [32, 33] that a very sharp tool should promote brittle-regime machining and for this reason, a sharp cutting edge was deliberately used in this study to probe brittle-regime dominated machining.”