Some observations on the wear of diamond tools in ultra-precision cutting of single-crystal silicon
By Jiwang Yan, K. Syoji, J. Tamaki. 2003
194 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/90b66d7a7a20a1594b9118b195f5277c7e278dbb
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In Biomedical Engineering
In Materials Chemistry
In Mechanical Engineering
Citations in the corpus
- Mechanism for material removal in diamond turning of reaction-bonded silicon carbide (2009, unknown): “This wear pattern is similar to that obtained from the ultraprecision cutting of Si wafers [24], although the total cutting distance in this study is much shorter than that used in Si machining.”
- Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo (2017, background): “Near the region contacting with the uncut surface, however, undeformed chip thickness is very large, thus brittle mode cutting leads to micro impacts to the tool, causing micro chippings to happen [38].”
- Diamond machining of silicon: A review of advances in molecular dynamics simulation (2015, unknown): “addition, tool geometry, crystal orientation and the quality of the diamond gem have all been found to influence tool wear significantly [49, 72, 188-189].”