How do carbon nanotubes fit into the semiconductor roadmap?

By A. Graham, Georg S. Duesberg, W. Hoenlein, Franz Kreupl, M. Liebau, R. Martin, B. Rajasekharan, W. Pamler, R. Seidel, W. Steinhoegl and 1 more. 2005

197 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/5e5e293f203c6f8e44d47c73bc1199727f80d328

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In Biomedical Engineering

In Materials Chemistry

Citations in the corpus

Conductance Modeling for Graphene Nanoribbon (GNR) Interconnects (2007, background): “The sp2 carbon bonds in CNTs are even stronger than the sp3 bonds in diamonds, which make CNTs mechanically strong [2].”
Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems (2007, background): “The sp2 bonding in graphene is even stronger than the sp3 bonding in diamond [2], and carbon nanotubes, therefore, have very high mechanical strengths.”
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, background): “Both SWCNT and MWCNT bundle can be grown using CVD methods on semiconductor wafers with standard semiconductor production equipment [67].”
Carbon nanostructures for advanced composites (2006, background): “These applications include field emitters for display technologies [10], reinforcing structures and heat pipes for nanocomposites, x-ray emitters for medical applications [11], nanowires and one-dimensional junctions for nano- and microelectronics applications [12] and scanning probe tips for nanosc”