Fracture toughness of polysilicon MEMS devices

By H. Kahn, N. Tayebi, R. Ballarini, Robert L. Mullen, A. Heuer. 2000

157 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/3eef62dee5aa0666739085804fdfa6501e010d56

How researchers see this paper

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In Biomedical Engineering

1. W. V. Spengen

In Electrical and Electronic Engineering

1. W. V. Spengen

Citations in the corpus

• MEMS reliability from a failure mechanisms perspective (2003, methodology): “[36] did not rely on the resonance frequency based crack length extraction of van Arsdell and Brown [29].”