A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface

By T. Kamgaing, Omar M. Ramahi. IEEE Microwave and Wireless Components Letters, 2003

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Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures (2004, background): “…source between the power planes and it represents either a large time-varying switching current driver (large ) or a fast time-varying switching circuit (small ) or even a combination of both. is the impedance of the signal generator used in simulations and experiments, usually equal to 50 ohms.”
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation (2010, background): “between the second and bottom layers [37] and/or using spiral pads on the second layer.”
A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits (2005, unknown): “844216 inductance-enhanced high impedance surface (HIS) and the concept of cascading EBG structures with different stop-bands were proposed to achieve wider bandgap bandwidth [5], [6], there are some drawbacks.”
Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits (2005, methodology): “However, multilayer substrates with specially designed via are required in the EBG structure for achieving the HIS on the ground plane [ 2 ].”