Closed-loop electroosmotic microchannel cooling system for VLSI circuits

By Linan Jiang, J. Mikkelsen, J. Koo, D. Huber, S. Yao, Lianpei Zhang, P. Zhou, J. Maveety, Ravi S. Prasher, Juan G. Santiago and 2 more. 2002

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Phase change phenomena in silicon microchannels (2005, background): “The latest idea is to directly attach a microchannel heat sink to the back side of the microprocessor while a coolant is pumped into the channels [6].”
Micromachined jets for liquid impingement cooling of VLSI chips (2004, methodology): “However, by incorporating this device in a closed loop, a vacuum pump can be used to decrease the pressure below atmospheric pressure such that the saturation temperature of water can be decreased [27], [ 28 ].”
Electroosmotic pumps and their applications in microfluidic systems (2009, methodology): “1997), microelectronic equipment cooling (Jiang et al. 2002), drug delivery (Paul and Rakestraw 2000; Pikal 2001; Chen et al.”
Flow boiling in microchannels: Fundamentals and applications (2017, background): “[11] stated that conventional heat pipes cannot dissipate more than few tens of watts due to limitations in the wick thickness and cross sectional area of the pipe.”