Numerical optimization of the thermal performance of a microchannel heat sink

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Co-designing electronics with microfluidics for more sustainable cooling (2020, background): “Typical source-drain spacing for high electron mobility transistors in 85 >1kV applications matches the optimum dimensions for microchannel cooling of ~20 μm, [19], 86 [42]–[44].”
Heat transfer enhancement in microchannel heat sinks using nanofluids (2012, methodology): “The MCHS is considered a potential cooling device for applications such as very large scale integrated circuits and micro-electro mechanical system cooling systems [2–5].”
Manifold microchannel heat sink design using optimization under uncertainty (2014, background): “Several analytical and numerical models for predicting pressure drop and heat transfer through such heat sinks have been proposed in the literature [3-5].”
High Flux Heat Removal with Microchannels—A Roadmap of Challenges and Opportunities (2005, background): “A number of investigators have considered the microchannel design problem to arrive at an optimum heat exchanger configuration (e.g., Phillips [2], Knight et al. [10], Ryu et al. [ 11 ], Bergles et al. [12], and Upadhye and Kandlikar [13]).”
Optimal design of geometric parameters of double-layered microchannel heat sinks (2012, methodology): “transfer characteristics [2–5,19–38].”
Three-dimensional numerical optimization of a manifold microchannel heat sink (2003, methodology): “8 and also in the earlier study about the TMC heat sink [4].”