Three-dimensional numerical optimization of a manifold microchannel heat sink

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Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions (2018, background): “This increase indicates the importance of developing flow and jet impingement effects in manifold microchannels; these effects have been shown in numerical models [12] and in experimental testing of manifold microchannels with smaller channel widths [22].”
Co-designing electronics with microfluidics for more sustainable cooling (2020, background): “…Distorted Pin-Fin staggered 3D integration Experimental [62] Brunschwiler et al. 2009 Embedded In-line pin fin 3D integration Experimental [29] Ryu et al. 2003 - MMC General Numerical [66] Ohadi et al. 2013 Indirect (Chip not included) MMC General Numerical [65] Jung et al. 2019 Direct MMC…”
Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance (2019, background): “[5] numerical simulation results indicated that an optimized manifold design reduced the thermal resistance by 50% compared to a traditional microchannel heat sink.”
Geometric strategies for attainment of identical outflows through all of the exit ports of a distribution manifold in a manifold system (2009, methodology): “Oneof these is themanifoldsofmicrochannel arrays which are used in the cooling of high-heat-generating micro devices and electronic equipment, representative among which are [4–8].”