Temperature dependence of the force sensitivity of silicon cantilevers
By U. Gysin, S. Rast, P. Ruff, E. Meyer, Dong-weon Lee, P. Vettiger, C. Gerber. 2004
163 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/071e7a2af5f0735dc27bff08402ac1939428bdb6
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Atomic and Molecular Physics, and Optics
In Electrical and Electronic Engineering
Citations in the corpus
- Dissipation in nanoelectromechanical systems (2014, background): “) To date, the smallest structures in which thermoelastic damping has been confirmed as a dominant source of dissipation are in the thickness range on the order of 1–2μm [160,161,152] and even at thicknesses as small as 500 nm for short beam lengths of 6μm [148].”
- Electrical, Thermal, and Mechanical Characterization of Silicon Microcantilever Heaters (2006, unknown): “where is Young’s modulus at 0 K and and are constants [ 49 ].”
- Thermo-mechanical behavior of low-dimensional systems: The local bond average approach (2009, methodology): “Temperature dependence The thermal depression of the Young’s modulus Y was attributed to anharmonic effects of the lattice vibrations [411].”