Y. Chiu
Polymers and Plastics · with Liu · 2002–2007
A researcher in the Science corpus: 4 papers; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Polymers and Plastics — 21 citations into it
- Materials Chemistry — 12 citations into it
- Organic Chemistry — 6 citations into it
Whom Y. Chiu trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from Y. Chiu's perspective
Ordered by how strongly the researchers Y. Chiu trusts endorse each paper. Same corpus, a different order for every researcher.
- Influence of cultivation temperature on the ligninolytic activity of selected fungal strains
- A and V
- Preparation and characterization of crosslinked PVA/SiO2 hybrid membranes containing sulfonic acid groups for direct methanol fuel cell applications
- Morphology and properties of UV/ozone treated graphite nanoplatelet/epoxy nanocomposites
- 3D printing of polymer matrix composites: A review and prospective
- Kinetic analysis of crystallization processes in amorphous materials
- Solid-state kinetic models: basics and mathematical fundamentals. (Journal of Physical Chemistry B)
- A Study of Epoxy-Amine Cure Kinetics by Combining Isoconversional Analysis with Temperature Modulated DSC and Dynamic Rheometry
- Prediction of thermal stability of materials by modified kinetic and model selection approaches based on limited amount of experimental points
- Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC
Their papers
- Thermal stability and degradation kinetics of novel organic/inorganic epoxy hybrid containing nitrogen/silicon/phosphorus by sol–gel method (2007) — 172 citations
- Preparation, thermal properties, and flame retardance of epoxy–silica hybrid resins (2003) — 158 citations
- Thermal stability of epoxy resins containing flame retardant components: an evaluation with thermogravimetric analysis (2002) — 179 citations
- Epoxy resins possessing flame retardant elements from silicon incorporated epoxy compounds cured with phosphorus or nitrogen containing curing agents (2002) — 239 citations