Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC
By Hongyang Cai, Peng Li, G. Sui, Yunhua Yu, Gang Li, Xiaoping Yang, Seung-Kon Ryu. 2008
182 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanical Engineering, Polymers and Plastics
View Paper: https://www.semanticscholar.org/paper/ccdbe409e4e2f31c5c659e0fa4a5ecc44d76dcd6
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Materials Chemistry
- K. Chrissafis
- Nicolas Sbirrazzuoli
- Sergery Vyazovkin
- N. Koga
- J. Lee
- Nam-Hoon Kim
- M. L. Lorenzo
- Joan Josep Suñol
In Mechanical Engineering
In Polymers and Plastics
- Sergery Vyazovkin
- N. Koga
- Nicolas Sbirrazzuoli
- K. Chrissafis
- J. Lee
- Nam-Hoon Kim
- M. L. Lorenzo
- Joan Josep Suñol
Citations in the corpus
- Highly curable epoxy/MWCNTs nanocomposites: An effective approach to functionalization of carbon nanotubes (2015, background): “The literature gives access to diverse experimental information on the cure kinetics of epoxy–amine systems based on thermometric data [7,8].”
- Effects of dual component microcapsules of resin and curing agent on the self-healing efficiency of epoxy (2013, background): “The reaction between the epoxy and the hardener is exothermic in nature [35].”
- ICTAC Kinetics Committee recommendations for collecting experimental thermal analysis data for kinetic computations (2014, background): “Due to the sensitivity and time constant of a DSC instrument, the temperature range of isothermal experiments is unavoidably narrower than that of the non-isothermal ones that is a disadvantage for kinetic computations [50,51], There are two ways to heat a sample from an ambient to an isothermal tem”