Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

By V. Suntharalingam, R. Berger, J. Burns, Chenson Chen, C. Keast, J. Knecht, R. Lambert, K. Newcomb, D. O'Mara, D. Rathman and 8 more. ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005., 2005

141 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/fb909254e749f0802db4523f23f95ec2833f5c61

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Citations in the corpus

• Demystifying 3D ICs: the pros and cons of going vertical (2005, methodology): “For these designs, MITLL offers a special “back-metal”, which is applied above tier C and connected to the BC-inter-tier vias.”