A review of focused ion beam applications in microsystem technology

By S. Reyntjens, Robert Puers. 2001

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Ultra-thin chips for high-performance flexible electronics (2018, methodology): “In PIE, the atoms from the back of the substrate are removed by bombarding it with energetic ions or gas assisted etching.(55) The etch rate depends on parameters such as scanning style, substrate chuck table angle, beam angle etc.”
Recent developments in micromilling using focused ion beam technology (2004, background): “The MCP helps in recording the secondary electron emission and thereby helps in viewing the substrate (Reyntjens and Puers 2001).”
A review on 3D micro-additive manufacturing technologies (2012, methodology): “Reyntjens and Puers utilized W(CO)6 as an organometallic precursor gas for deposition of W [205].”
Review on Micro- and Nanolithography Techniques and Their Applications (2012, background): “On the other hand, maskless lithography, such as electron beam lithography [22-29], focused ion beam lithography [30-33], and scanning probe lithography [34-44], fabricates arbitrary patterns by a serial writing without the use of masks.”