Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density
By Yonghao Zhao, J. Bingert, Yuntian Zhu, Xiaozhou Liao, R. Valiev, Z. Horita, Terence G. Langdon, Yizhang Zhou, Enrique J. Lavernia. 2008
181 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/f346c46e2e8069d78f0fc85176d07e5f74ca74e2
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Materials Chemistry
- Yuntian Zhu
- R. Valiev
- Terence G. Langdon
- Z. Horita
- Xiaolei Wu
- Yuri Estrin
- Michael Zehetbauer
- I. Ovid’ko
In Mechanical Engineering
- Yuntian Zhu
- R. Valiev
- Terence G. Langdon
- Z. Horita
- Xiaolei Wu
- Yuri Estrin
- Michael Zehetbauer
- I. Ovid’ko
Citations in the corpus
- Fundamentals of Superior Properties in Bulk NanoSPD Materials (2016, background): “[5,25] Reported successful strategies include inducing effects that promote the occurrence of a high density of twin boundaries,[12,48,49] lowering the stacking fault energy to activate deformation twinning,[12,14,50] introducing a high density of second-phase nanoparticles,[13,51] or through grain ”
- Ductility and Plasticity of Nanostructured Metals: Differences and Issues (2018, background): “Many strategies have been proposed to enhance the ductility of nanostructured metals, including preexisting and deformation twins [15,21e49], second-phase precipitates [16,50e62], hetero-phase interfaces/grain boundaries [63e65], stacking faults [66e68], and high-angle grain boundaries [17,69,70].”