Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

By I. Anderson, J. Foley, B. Cook, J. Harringa, R. Terpstra, Ö. Ünal. 2001

221 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/f0cde931849526163ca7b57070b6b3f01aa0bddc

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In Electrical and Electronic Engineering

1. Abdul Haseeb

Citations in the corpus

• Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “This wide variation of wetting angle is probably related to factors such as alloy composition, processing atmosphere, flux type, soldering temperature, substrate metallurgy etc [23,28,29].”