Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

By F. Ochoa, Jason J. Williams, Nikhilesh Chawla. 2003

185 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/f0557142942734d76171ffb1e7093012662fa3e1

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “5Ag)–1Zn sol in the Sn-rich phase, giving a fine dispersion of Ag3Sn, whilst a decreased cooling rate results in needle-like Ag3Sn [97].”