Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

By Jianfeng Li, Samjid H. Mannan, M. Clode, D. Whalley, D. Hutt. 2006

217 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/edfbd2f4963eced56d651ef51ca2c2e4aee18510

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “%) appear to have no significant effect on the IMC growth under high temperature storage, [105] either failing to form an appropriate barrier or failing to slow down IMC growth.”