Heterogeneous Silicon Photonic Integrated Circuits
By T. Komljenovic, M. Davenport, J. Hulme, Alan Y. Liu, C. Santis, A. Spott, S. Srinivasan, E. Stanton, Chong Zhang, John E. Bowers. Journal of Lightwave Technology, 2016
273 citations recorded by the source corpus.
Subfields: Artificial Intelligence, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/ddb22e8af681840faae5e308b67d886407c50fc7
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Artificial Intelligence
- Christopher R. Monroe
- Dirk Englund
- Jungsang Kim
- Mikhail D. Lukin
- Michael G. Raymer
- R. Walsworth
- A. Safavi-Naeini
- Lincoln D. Carr
In Electrical and Electronic Engineering
- Dirk Englund
- John E. Bowers
- David A. B. Miller
- Marko Loncar
- Jelena Vuckovic
- Mikhail D. Lukin
- Edo Waks
- A. Safavi-Naeini
Citations in the corpus
- Attojoule Optoelectronics for Low-Energy Information Processing and Communications (2016, background): “proaches that can avoid problems with lattice mismatch [117], [119], [124], [173], [174], [175], or using heterogeneous integration of III-V device structures [50], [171], [172], [176], [177] or other materials such as organics [87], [109] 4) technology for electrically connecting such optoelectroni”
- Integrated microwave photonics (2015, result): “Recent developments have shown that heterogeneous integration not only allows for a reduced cost due to economy of scale, but also allows for same or even better performing devices than what has previously been demonstrated utilizing only III-V materials [1].”
- Development of Quantum Interconnects (QuICs) for Next-Generation Information Technologies (2021, background): “For example, rather than developing new QFC resources in III-V materials or diamond, heterogeneous integration [144] with Si3N4, AlN, or LN would enable a direct coupling of the matter-photonic qubit interface with the QFC interface.”