Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

By Jiwang Yan, T. Asami, H. Harada, Tsunemoto Kuriyagawa. 2009

260 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/d8bbcdbee9b3520ad4fc6b5d724ba812ce74e25a

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Atomic and Molecular Physics, and Optics

1. Alexander Stukowski
2. Saurav Goel

In Biomedical Engineering

1. Saurav Goel
2. M. Mukaida
3. Alexander Stukowski
4. Jiwang Yan
5. Xichun Luo

In Materials Chemistry

1. Saurav Goel
2. M. Mukaida
3. A. Kovalchenko
4. G. Cross
5. Alexander Stukowski
6. Jiwang Yan
7. Xichun Luo
8. M. Yaghoobi

Citations in the corpus

• Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo (2017, result): “This fact agrees with previous results where amorphous and poly-crystalline chips are generated in ductile cutting [36].”
• Influence of microstructure on the cutting behaviour of silicon (2016, result): “It was anticipated that dislocation nucleation might occur during the process of nanometric cutting [41], but no dislocations were found to travel ahead of the tool that will drive plasticity in silicon (this is possible due to scale limitations of the MD) since experimental studies reported presenc”