High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
By K. Sarakinos, J. Alami, S. Konstantinidis. 2010
986 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/d5edb742d13342bbfdd76db55ea8868139d9ab89
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In Electrical and Electronic Engineering
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Citations in the corpus
- Perspectives on oblique angle deposition of thin films: From fundamentals to devices (2016, background): “Although the influence of the deposition angle in combination with other deposition parameters on the microstructure and texture of HIPIMS-deposited thin films has not been systematically investigated, differences between conventional MS and HIPIMS have been observed in the deposition of Cu and Cr f”
- An introduction to thin film processing using high-power impulse magnetron sputtering (2012, background): “HiPIMS can be set up on a conventional magnetron sputtering system by changing power supplies making it possible to deliver high power pulses to the magnetron in the range of a few kilowatts per square centimeter while keeping the time-averaged power on a DCMS level of typically watts per square cen”
- Wear resistance investigation of titanium nitride-based coatings (2015, neutral): “balanced and magnetron unbalanced sputtering [66-67].”