Principles of Plasma Discharges and Materials Processing, 2nd Edition

By M. Lieberman, A. Lichtenberg. 2003

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100 years of the physics of diodes (2017, background): “312 A comprehensive investigation by Hershkowitz 316 showed that in low temperature collisionless and weakly collisional plasmas, the CL law provides a good ﬁt to the sheath potential proﬁle for both ion and electron sheaths when eV (cid:11) T e .”
Helicon-type radiofrequency plasma thrusters and magnetic plasma nozzles (2019, methodology): “ 6.6 of Lieberman and Lichtenberg (2005).”
Plasma-Assisted Atomic Layer Deposition: Basics, Opportunities, and Challenges (2011, unknown): “317 Such methods were inspired by conﬁgurations designed for other plasma-assisted material processing techniques such as plasma etching, ion implantation, and deposition by PECVD or PVD. 299 One conﬁguration recently reported has a capacitively-coupled remote plasma (a direct plasma with a grid), i”