Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

By M. Cho, Sung K. Kang, D. Shih, Hyuck-Mo Lee. 2007

140 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ce04023d8159c84b0d5d928e88b02c2d1092e201

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “In SAC/Cu joints, one typically observes Cu6Sn5 IMC at the interface, with Cu3Sn arising after thermal ageing [7,9,15,69,70].”