High dielectric constant polyaniline/epoxy composites via in situ polymerization for embedded capacitor applications

By Jiongxin Lu, Kyoung-Sik Moon, Byung‐Kook Kim, C. Wong. 2007

208 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/ccf287f009d32900a860574407fb807df64f8d26

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In Biomedical Engineering

1. C. Wong
2. Jiongxin Lu

In Materials Chemistry

1. C. Wong
2. Jiongxin Lu

Citations in the corpus

• Recent advances in high-k nanocomposite materials for embedded capacitor applications (2008, background): “Lu et al. reported a PANI/epoxy composite prepared by in-situ polymerization with a high dielectric constant close to 3000, a dielectric loss tangent less than 0.5 at room temperature and 10 kHz [ 28 ].”