Recent advances in high-k nanocomposite materials for embedded capacitor applications

By Jiongxin Lu, C. Wong. IEEE transactions on dielectrics and electrical insulation, 2008

162 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/2db08497f7910bcbace00d0f114bcd89a8d7cc89

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. P. Jiang
2. Xingyi Huang
3. Chao Wu
4. Jinhong Yu

In Electronic, Optical and Magnetic Materials

1. P. Jiang
2. Xingyi Huang

In Materials Chemistry

1. P. Jiang
2. Xingyi Huang
3. Jinhong Yu

Citations in the corpus

• Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation (2010, unknown): “The connection inductance can be further reduced using a package technology called the capacitor inside the substrate, which can put the discrete capacitor just beneath the chip with lower ESL [27].”
• Permittivity, thermal conductivity and thermal stability of poly(vinylidene fluoride)/graphene nanocomposites (2011, background): “Introducing ceramic and metal particles could increase the permittivity of a polymer [6-8].”