Tin-silver-copper eutectic temperature and composition

By M. Loomans, M. Fine. 2000

172 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, General Materials Science, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c773b2fc861b371388d5050687ce07ef42ddc98f

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “There are various works of interest here [21–26], including by Loomans and Finen [23] who reported a ternary eutectic temperature of 217.2 ± 0.2 C, and a composition of 3.5 wt.% Ag and 0.9 wt.% Cu, and Moon et al. [22] who reported the eutectic composition to be 3.5 wt.% Ag ± 0.3 wt.% Ag and 0.9 wt.”