A review of high-temperature electronics technology and applications

By J. Watson, G. Castro. Journal of materials science. Materials in electronics, 2015

343 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/c6a1516df3ff879145158fb67ddfa60f0a04709f

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. R. Tummala
2. V. Smet
3. Haksun Lee

Citations in the corpus

• A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues (2020, background): “losing their properties rapidly as the temperature is increased above 200 ◦C [34].”