Myths and rumours of silicon photonics

By T. Baehr‐Jones, Thierry Pinguet, Patrick Lo Guo-Qiang, S. Danziger, D. Prather, Michael Hochberg. Nature Photonics, 2012

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Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices (2016, unknown): “A temperature variation f 20 ◦C is often sufficient for a PIC to drift out of its operational profile [55,56].”
Silicon Photonics: The Next Fabless Semiconductor Industry (2013, unknown): “The cost of mask sets and process development in CMOS-compatible manufacturing facilities can also be very high in advanced processes [1].”
Non-Invasive On-Chip Light Observation by Contactless Waveguide Conductivity Monitoring (2014, unknown): “ploit the potential of photonic integration [1].”
Micro-combs: A novel generation of optical sources (2017, background): “These first-generation silicon photonic chips feature highly-sophisticated circuits comprised of splitters, filters, multiplexers and modulators and they offer the substantial benefit of exploiting siliconintegrated circuit technology (ComplementaryMetal Oxide Semiconductor (CMOS)), although not wit”