Fundamentals of microfabrication : the science of miniaturization

By M. Madou. 2002

2,037 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/c2560f37f6d8430bd21568b45dc0ea46a0acf3b8

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Citations in the corpus

Engineering microscale topographies to control the cell–substrate interface (2012, methodology): “This technique is widely used to generate rigid microstructures on inorganic materials such as silicon and silicon oxide [39,40].”
Some innovative surface texturing techniques for tribological purposes (2015, methodology): “Various experimental conditions were tried, based on recommendations found in the literature.(98) Before texturing, the samples were cleaned in acetone in an ultrasonic bath.”
Recent developments in nanofabrication using focused ion beams. (2005, background): “Heavily B-ion-doped Si has also been frequently adopted as an etch stop or mask for different etching processes for nanoelectromechanical systems (NEMS) devices.([39])”
Optically pumped planar waveguide lasers, Part I: Fundamentals and fabrication techniques (2011, background): “incidence of ions, (ii) redeposition of material removed from the bottom of the grooves that define the channels on the sidewalls, (iii) backscattering of etching products and their redeposition on the substrate (iv) non-uniform etching due to deviation from the perpendicular ion incidence caused by”
Microinjection molding of thermoplastic polymers: a review (2007, methodology): “For the fabrication of sub-micronic structures, LIGA techniques, silicon wet bulk micromachining and deep reactive ion etching methods are commonly used [35, 36].”
Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011, background): “This can, in principle, be done with any suitable intermediate layer bonding technology using polymer [74]–[82] or inorganic intermediate layers [1], [83]–[87].”
Xurography: rapid prototyping of microstructures using a cutting plotter (2005, background): “Laser ablation produces features on the order of sub-microns ( nm) [19], with an aspect ratio up to 10 [20].”