Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

By Dae-Hyeong Kim, Yun-Soung Kim, Jian Wu, Zhuangjian Liu, Jizhou Song, Hoon-sik Kim, Yonggang Huang, K. Hwang, John A. Rogers. 2009

384 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/c083b7274c04eb7c60b3fe5182ae772a7b8b4c12

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Nanshu Lu
2. John A. Rogers
3. Dae-Hyeong Kim
4. Yonggang Huang
5. Yi Cui
6. Liangbing Hu
7. Roozbeh Ghaffari
8. Ralph G. Nuzzo

In Electrical and Electronic Engineering

1. Yi Cui
2. Dae-Hyeong Kim
3. Nanshu Lu
4. Liangbing Hu
5. John A. Rogers
6. J. Choi
7. Yuan Yang
8. Ralph G. Nuzzo

Citations in the corpus

• Waterproof AlInGaP optoelectronics on stretchable substrates with applications in biomedicine and robotics. (2010, methodology): “In all cases, transfer printing successfully delivers the devices to these substrates with thin (∼50 μm) coatings of PDMS that serve as planarizing and strain-isolating layers, and as adhesive”
• Transfer printing techniques for flexible and stretchable inorganic electronics (2018, background): “, inorganic thin film transistors-TFTs,(32) inorganic light emitting diodes-ILEDs(20), and solar cells(23,24)) and fully integrated inorganic circuits.(2,28,35) It should be noted that the inks for transfer printing are not limited to inorganic materials, but can also be other materials such as carb”