Transfer printing techniques for flexible and stretchable inorganic electronics
By Changhong Linghu, Shun Zhang, Chengjun Wang, Jizhou Song. npj Flexible Electronics, 2018
303 citations recorded by the source corpus.
Transfer printing is an emerging deterministic assembly technique for micro-fabrication and nano-fabrication, which enables the heterogeneous integration of classes of materials into desired functional layouts. It creates engineering opportunities in the area of flexible and stretchable inorganic electronics with equal performance to conventional wafer-based devices but the ability to be deformed like a rubber, where prefabricated inorganic semiconductor materials or devices on the donor wafer are required to be transfer-printed onto unconventional flexible substrates. This paper provides a brief review of recent advances on transfer printing techniques for flexible and stretchable inorganic electronics. The basic concept for each transfer printing technique is overviewed. The performances of these transfer printing techniques are summarized and compared followed by the discussions of perspectives and challenges for future developments and applications.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/79ac3a06e3106f7974ca32fd137f0b8bfdd83fad
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Citations in the corpus
- Flexible Electronics: Status, Challenges and Opportunities (2020, background): “Though the thinning of rigid substrates and pattern transfer methodologies can be utilized to avoid these complications, as well as extreme processing conditions which flexible polymeric conditions cannot withstand (Linghu et al., 2018).”