High aspect ratio micro-hole drilling aided with ultrasonic vibration and planetary movement of electrode by micro-EDM
By Zuyuan Yu, Yan Zhang, Jianzhong Li, J. Luan, F. Zhao, Dongming Guo. 2009
179 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/b7c08b0d0e96e1db2b5be9a286464e8a547055a2
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
- Jiwang Yan
- Tsunemoto Kuriyagawa
- Pay Jun Liew
- Murali M. Sundaram
- K. Rajurkar
- Ajay P. Malshe
- Anish Kumar
- Sung-hoon Ahn
In Electrical and Electronic Engineering
- Jiwang Yan
- Pay Jun Liew
- Tsunemoto Kuriyagawa
- Murali M. Sundaram
- K. Rajurkar
- Ajay P. Malshe
- Anish Kumar
- Sung-hoon Ahn
In Mechanical Engineering
- Jiwang Yan
- Pay Jun Liew
- Tsunemoto Kuriyagawa
- Murali M. Sundaram
- K. Rajurkar
- Ajay P. Malshe
- Anish Kumar
Citations in the corpus
- Multiple performance characteristics optimization for Al 7075 on electric discharge drilling by Taguchi grey relational theory (2015, background): “Yu et al. (2009) said that when a micro-hole is drilled deeply by EDM, the viscous resistance in the narrow discharge gap causes difficulty in the removal of debris and bubbles from the working area, leading to frequent occurrences of abnormal discharges and resulting in extensive electrode wear.”
- Hybrid manufacturing in micro/nano scale: A Review (2014, result): “Nanyang Technical University reported an increase in the aspect ratio of 232 Dalian University of Technology reported an increase in the volumetric removal rate of 250% and an increase in the aspect ratio of 125% compared with no vibration.(51) Harbin Institute of Technology reported improvements in”
- Review of Electrochemical and Electrodischarge Machining (2013, background): “A combination of ultrasonic vibrations and planetary tool movement generates micro holes with aspect ratio as high as 29 (figure 13) [158].”
- Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM (2014, methodology): “Ultrasonic vibration has also been carried out in combination with other process improvements, such as EDM using non-circular electrode [13,14], planetary movement of tool [15], helical micro-tool [16], and micro-powders [17].”