Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM

By Pay Jun Liew, Jiwang Yan, Tsunemoto Kuriyagawa. 2014

150 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c458f2b2377e528983434783d4afb7b91474440e