Crystallographic effect on subsurface damage formation in silicon microcutting

By Jiwang Yan, T. Asami, H. Harada, Tsunemoto Kuriyagawa. 2012

141 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/b0ffac017209ce0eac2b557dff4738f6cc94ce19

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. M. Mukaida
2. Jiwang Yan

In Mechanical Engineering

1. M. Mukaida
2. Jiwang Yan

Citations in the corpus

• Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo (2017, result): “This agrees with the previous results that the critical chip thickness of < 110 > direction is smaller than that of < 100 > direction when cutting single-crystal silicon (001) [33].”