An overview of the reliability prediction related aspects of high power IGBTs in wind power applications

By Cristian Busca, Remus Teodorescu, Frede Blaabjerg, S. Munk‐Nielsen, Lars Helle, Tusitha Abeyasekera, Pedro Rodriguez. Microelectronics and reliability, 2011

298 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/af34942cfb587ff600684f7d9049792a46b4b2c8

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Frede Blaabjerg
2. Huai Wang
3. U. Choi
4. Marco Liserre
5. Ke Ma
6. Søren Jørgensen
7. Kyo-Beum Lee
8. Yihua Hu

In Materials Chemistry

1. Frede Blaabjerg

Citations in the corpus

• Wind Energy Systems (2017, background): “Triggered by the complex mission profiles, the thermal cycles or dynamic temperature variations are one of the main causes of failure for the power electronic components [56]–[58].”
• In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives (2015, background): “With regard to IGBTs, major wear-out failures are bondwire lift-off and baseplate solder fatigue [24], [25].”
• New Approaches to Reliability Assessment: Using physics-of-failure for prediction and design in power electronics systems (2016, background): “, temperature swings inside or outside the devices) is one of the most critical stressors in power electronics components [10], [11], [14], [15].”
• Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics (2014, background): “If T0 is negligible compared with T , it can be dropped out from the above equation, which then becomes the Coffin–Manson model discussed in [56]–[58].”
• Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress (2018, background): “Therefore, the wire-bonded power device modules are still the most widely used in PESs [33], [34].”
• Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems (2015, methodology): “The lifetime prediction models can be classified into empirical and more physical-based models [10].”
• Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities (2013, background): “If T0 D is negligible compared with , T D it can be dropped out from the aforementioned equation, which then turns into the Coffin–Manson model, as discussed in [4].”