Enhanced Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness

By H. Honda, H. Takamastu, J. J. Wei. 2002

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Effects of Fin Geometry on Boiling Heat Transfer from Silicon Chips with Micro-Pin-Fins Immersed in FC-72 (2003, background): “[7] studied the effects of square micro-pin-fins (50 · 60 lm in thickness ·height and 100 lm in fin pitch) and submicron-scale roughness (about 30 nm in r.”
Boiling heat transfer in a hydrofoil-based micro pin fin heat sink (2007, background): “Honda and co-workers in several recent publications [74–76] utilized successfully micro pin fins to augment the critical heat flux (CHF) conditions in electronic components.”
Review of pool boiling enhancement by surface modification (2019, methodology): “[149] showed that a silicon surface modified with 50 50 60 lm(3) square microfins with 25–32 nm surface roughness provided better nucleate boiling performance at high heat fluxes in FC-72 than surfaces employing the same enhancement scales separately.”
A critical synthesis of thermophysical characteristics of nanofluids (2011, unknown): “[114] and Wei et al.”