Effects of Fin Geometry on Boiling Heat Transfer from Silicon Chips with Micro-Pin-Fins Immersed in FC-72

By J. J. Wei, H. Honda. 2003

247 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/d140356789033a95bd2eca34f6cf2aa327117f86

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Computational Mechanics

1. Gangtao Liang
2. I. Mudawar
3. Satish G. Kandlikar
4. K. Leong
5. K. K. Wong
6. Yen-Wen Lu
7. Jinliang Xu
8. Guohua Liu

In Mechanical Engineering

1. Gangtao Liang
2. I. Mudawar
3. K. Leong
4. K. K. Wong
5. Satish G. Kandlikar
6. Yen-Wen Lu
7. Z. Yao
8. Jinliang Xu

Citations in the corpus

• Effects of nanowire height on pool boiling performance of water on silicon chips (2011, methodology): “The recent surface treatment methods include increasing the surface area with micro pin-fins [1], applying wicking structures to promote the liquid supply by capillary pumping [2,3], and depositing nano-particles or coating with nanomaterials [4e6].”
• Saturated pool boiling enhancement using porous lattice structures produced by Selective Laser Melting (2018, background): “Surface modification A thorough literature review on the use of surface microstructures for pool boiling enhancement was performed by Honda and Wei [1].”
• Pool boiling heat transfer of ultra-light copper foam with open cells (2008, background): “We found that copper foams with open cells could decrease the surface superheat and eliminate the temperature excursion at boiling incipience, which is consistent with that drawn by other studies such as Wei and Honda (2003) for micro-pin-fin structure, Parker and El-Genk (2005) for graphite foams.”
• Review of pool boiling enhancement by surface modification (2019, methodology): “[154,155] showed, for FC-72, that CHF for surfaces with square micro-fins increased with increasing fin height for a fixed fin width, while, for fixed non-dimensional roughness, CHF increased with increasing fin width [155].”
• Pool boiling heat transfer on horizontal rectangular fin array in saturated FC-72 (2007, background): “Recently, Honda [15] observed silicon chips with the micropin-fin boiling in FC-72 and found that micro-pin-fin chip exhibited a considerably greater heat transfer.”