Interfacial reactions between lead-free solders and common base materials

By Tomi Laurila, V. Vuorinen, J. Kivilahti. 2005

1,094 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ac7623df7c3f036c90d312809dd934d36328d9cf

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “Many studies have focussed on the chemical reactions of Sn, specifically with Cu and Ni substrates, as it is of major importance in Pb-free solders [3,4,6,32].”