A 3-D-Lumped Thermal Network Model for Long-Term Load Profiles Analysis in High-Power IGBT Modules
By Amir Sajjad Bahman, Ke Ma, P. Ghimire, Francesco Iannuzzo, Frede Blaabjerg. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2016
153 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/a93c582ca1fb68925c06ea616fb5244b0e19ff0d
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Electrical and Electronic Engineering
- Frede Blaabjerg
- Ke Ma
- Amir Sajjad Bahman
- P. Wheeler
- Tomislav Dragicevic
- Huai Wang
- Xiongfei Wang
- Marco Liserre
In Mechanical Engineering
Citations in the corpus
- A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules (2018, methodology): “The number of exponential terms determines the number of RC elements in the RC thermal network [20].”
- New Approaches to Reliability Assessment: Using physics-of-failure for prediction and design in power electronics systems (2016, unknown): “More details of this multitime scale thermal modeling approach can be found in [18], and the interaction between different levels of modeling techniques was demonstrated in [19].”
- Artificial Intelligence Aided Automated Design for Reliability of Power Electronic Systems (2019, result): “These investigations can be carried out either experimentally or using detailed simulations models, which have been shown to match excellently the experimental results [12], [13].”