A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

By Amir Sajjad Bahman, Ke Ma, Frede Blaabjerg. IEEE transactions on power electronics, 2018

253 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/1c2ff350d48a416243c30031c924dfa979131d3e