Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy

By X. Shi, H. Pang, W. Zhou, Z. Wang. 2000

167 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/a4c8ac5bd77f134de2c0105d45b0cd2ca42b5e62

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. D.Y.R. Chong

Citations in the corpus

• Thermal cycling analysis of flip-chip solder joint reliability (2001, methodology): “Some differences were observed in the plots of equivalent creep strain for the “ dwell creep” and “full creep” methods given in Fig. 8 [ 12 ].”