Thermal cycling analysis of flip-chip solder joint reliability

By J. Pang, D.Y.R. Chong, T. H. Low. 2001

171 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/a0d62052fa311f4ee3a4c90d478f4e8310d562c8