Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects

By G. Basim, Joshua J. Adler, Uday Mahajan, R. Singh, B. Moudgil. 2000

181 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Civil and Structural Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/a018b5a4d1a48888f840a8e51310a9a0832b6266

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. David A. Dornfeld
2. Jianfeng Luo
3. Dan Guo
4. G. Xie
5. T. Suratwala
6. Jianbin Luo
7. V. Jain

In Mechanical Engineering

1. David A. Dornfeld
2. Jianfeng Luo
3. Dan Guo
4. Jianbin Luo
5. G. Xie
6. V. Jain

Citations in the corpus

• Mechanical properties of nanoparticles: basics and applications (2014, background): “Good controls over the mechanical properties of particles and their interactions with the polished surface etc are important for improving the surface quality and enhancing material removal [15, 16].”
• Effect of rogue particles on the sub-surface damage of fused silica during grinding/polishing (2006, background): “[12] spiked colloidal silica slurries with rogue silica particles and found that scratch densities increased with rogue particle size and concentration.”
• Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification (2003, background): “Connections between the size distribution and the scratching of wafer surface have also been observed and reported [5], [6].”