Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations
By Dae-Hyeong Kim, Jizhou Song, W. Choi, Hoon-sik Kim, Rak-Hwan Kim, Zhuangjian Liu, Yonggang Huang, K. Hwang, Yong-wei Zhang, John A. Rogers. Proceedings of the National Academy of Sciences of the United States of America, 2008
692 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering
View Paper: https://www.semanticscholar.org/paper/9bea4e0ce4b31b9b172af2c56bc9d55ba456f9c1
How researchers see this paper
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In Atomic and Molecular Physics, and Optics
- Yonggang Huang
- Hyun‐Joong Chung
- Kenneth D. Harris
- A. Elias
- Saleem Khan
- John A. Rogers
- Leandro Lorenzelli
- Ravinder S. Dahiya
In Biomedical Engineering
- Nanshu Lu
- Dae-Hyeong Kim
- Hyun‐Joong Chung
- Kenneth D. Harris
- A. Elias
- John A. Rogers
- Yonggang Huang
- Yihui Zhang
Citations in the corpus
- Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review (2015, methodology): “a flexible polyimide substrate using transfer printing of Si micro ribbons [111], [157], [162], [163].”