Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review

By Saleem Khan, Leandro Lorenzelli, Ravinder S. Dahiya. IEEE Sensors Journal, 2015

977 citations recorded by the source corpus.

Printing sensors and electronics over flexible substrates are an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, the complementarities, and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/noncontact printing technologies have been assessed on the basis of technological, materials, and process-related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll production lines for system level integration.

Subfields: Automotive Engineering, Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/2e7ed56f423b3054a22b6370dc4dca1bc7b8dc2e

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In Automotive Engineering

  1. C. K. Chua
  2. T. Tran
  3. H. Tan
  4. T. Rojo

In Biomedical Engineering

  1. Kostas Kostarelos
  2. M. Prato
  3. A. Bianco
  4. Francesco Bonaccorso
  5. C. K. Chua
  6. T. Tran
  7. H. Tan
  8. Leandro Lorenzelli

In Electrical and Electronic Engineering

  1. C. K. Chua
  2. T. Tran
  3. H. Tan
  4. Francesco Bonaccorso
  5. Andrea C. Ferrari
  6. C. Backes
  7. Xiaodong Zhuang
  8. Ravinder S. Dahiya

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